TY - GEN
T1 - Shear bond strength of experimental light-cured orthodontic adhesives
AU - Nimcharoensuk, Kanin
AU - Anuwongnukroh, Niwat
AU - Dechkunakorn, Surachai
AU - Sattabanasuk, Vanthana
AU - Wichai, Wassana
AU - Sunintaboon, Panya
N1 - Publisher Copyright:
© 2019 Trans Tech Publications Ltd, Switzerland.
PY - 2019
Y1 - 2019
N2 - The objective of this study was to compare shear bond strength (SBS) and adhesive remnant index (ARI) of domestically made orthodontic adhesives to a commercial orthodontic adhesive, Transbond XT (3M Unitek, USA). Three formulas of an in-house orthodontic adhesive were divided according to monomer ratio (BisGMA:TEGDMA) into group 1 (8:2), 2 (7:3), and 3 (6:4), respectively, with 60-70 weight % of filler amount and 0.5 % of photoinitiator (TPO). Eighty upper human premolars (20 of each group) were bonded with stainless-steel brackets with these experimental and control adhesives. All were cured by LED light-cured unit for 20 seconds. After polymerization for 24 hours, a universal testing machine was used to apply an occlusal shear force to the enamel/bracket interface at a speed of 0.5 mm/min. The ARI scores were evaluated for each debonded tooth. Mean SBS values were analyzed statistically using the One-way ANOVA and the Tukey’s test for multiple comparison. Chi-square test was used to determine significant difference in the ARI scores. The results showed that there was statistical difference in the mean SBS of 4 groups (P<.001). The SBS value of group 1, 2, 3, and control was 18.79 MPa, 18.58 MPa, 23.30 MPa, and 28.02 MPa, respectively. Chi-square comparison for the ARI indicated that there was significant difference (P=.012) between the groups. In conclusion, the experimental adhesive of group 3 yields the higher SBS than in group 1 and group 2. Although these adhesives provide a lower shear bond strength than Transbond XT, they were acceptable for clinical use. Most failures of Transbond XT were found between adhesive-bracket interface, whereas the three in-house experimental adhesives were found mixed failure patterns of ARI.
AB - The objective of this study was to compare shear bond strength (SBS) and adhesive remnant index (ARI) of domestically made orthodontic adhesives to a commercial orthodontic adhesive, Transbond XT (3M Unitek, USA). Three formulas of an in-house orthodontic adhesive were divided according to monomer ratio (BisGMA:TEGDMA) into group 1 (8:2), 2 (7:3), and 3 (6:4), respectively, with 60-70 weight % of filler amount and 0.5 % of photoinitiator (TPO). Eighty upper human premolars (20 of each group) were bonded with stainless-steel brackets with these experimental and control adhesives. All were cured by LED light-cured unit for 20 seconds. After polymerization for 24 hours, a universal testing machine was used to apply an occlusal shear force to the enamel/bracket interface at a speed of 0.5 mm/min. The ARI scores were evaluated for each debonded tooth. Mean SBS values were analyzed statistically using the One-way ANOVA and the Tukey’s test for multiple comparison. Chi-square test was used to determine significant difference in the ARI scores. The results showed that there was statistical difference in the mean SBS of 4 groups (P<.001). The SBS value of group 1, 2, 3, and control was 18.79 MPa, 18.58 MPa, 23.30 MPa, and 28.02 MPa, respectively. Chi-square comparison for the ARI indicated that there was significant difference (P=.012) between the groups. In conclusion, the experimental adhesive of group 3 yields the higher SBS than in group 1 and group 2. Although these adhesives provide a lower shear bond strength than Transbond XT, they were acceptable for clinical use. Most failures of Transbond XT were found between adhesive-bracket interface, whereas the three in-house experimental adhesives were found mixed failure patterns of ARI.
KW - Adhesive remnant index
KW - Light-cured orthodontic adhesive
KW - Shear bond strength
UR - https://www.scopus.com/pages/publications/85083988934
U2 - 10.4028/www.scientific.net/KEM.814.378
DO - 10.4028/www.scientific.net/KEM.814.378
M3 - Conference contribution
AN - SCOPUS:85083988934
SN - 9783035714883
T3 - Key Engineering Materials
SP - 378
EP - 383
BT - Advanced Materials and Engineering Materials VIII
A2 - Wei, Peng Sheng
PB - Trans Tech Publications Ltd
T2 - 8th International Conference on Advanced Materials and Engineering Materials, ICAMEM 2019
Y2 - 18 April 2019 through 19 April 2019
ER -