TY - GEN
T1 - Curing mechanism study for dual cure of epoxy adhesive by differential scanning calorimetry
AU - Weanawae, Waefatimah
AU - Pumkrachang, Santi
AU - Binzainudin, Syahril
AU - Vongsetskul, Thammasit
AU - Osotchan, Tanakorn
N1 - Publisher Copyright:
© 2016 Trans Tech Publications, Switzerland.
PY - 2016
Y1 - 2016
N2 - Epoxy adhesive used in electronic packaging could normally be cured by ultraviolet light, heat at high temperature or dual cured by both processes. Differential scanning calorimetry (DSC) has been used to identify and analyze the occurred reaction during the curing process. The structural modification of epoxy during curing could be examined by measuring its thermal properties, and the change in molecular structure of epoxy could be observed by a relative small area of DSC peak. This provided the heat amount required for complete cure. It is found that the DSC peak area after heat cure at 90 °C increased linearly as a function of heating time while that at 120 °C decreased exponentially. For UV cure, it indicated that the curing mechanism was strongly depend on the energy from UV light. For dual cure at 90 °C, the heat curing time could be reduced from single curing process of 50 minutes to 6 minutes, while the heating time for dual cure at 120°C could be reduced from 4 minutes to 2 minutes.
AB - Epoxy adhesive used in electronic packaging could normally be cured by ultraviolet light, heat at high temperature or dual cured by both processes. Differential scanning calorimetry (DSC) has been used to identify and analyze the occurred reaction during the curing process. The structural modification of epoxy during curing could be examined by measuring its thermal properties, and the change in molecular structure of epoxy could be observed by a relative small area of DSC peak. This provided the heat amount required for complete cure. It is found that the DSC peak area after heat cure at 90 °C increased linearly as a function of heating time while that at 120 °C decreased exponentially. For UV cure, it indicated that the curing mechanism was strongly depend on the energy from UV light. For dual cure at 90 °C, the heat curing time could be reduced from single curing process of 50 minutes to 6 minutes, while the heating time for dual cure at 120°C could be reduced from 4 minutes to 2 minutes.
KW - Cure mechanism
KW - Curing process
KW - Differential scanning calorimetry
KW - Epoxy adhesive
UR - https://www.scopus.com/pages/publications/85023606467
U2 - 10.4028/www.scientific.net/MSF.864.3
DO - 10.4028/www.scientific.net/MSF.864.3
M3 - Conference contribution
AN - SCOPUS:85023606467
SN - 9783038357254
T3 - Materials Science Forum
SP - 3
EP - 7
BT - 4th International Conference on Nano and Materials Engineering, 2016
A2 - Nindhia, Tjokorda Gde Tirta
A2 - Suherman, Hendra
A2 - Yuliarto, Brian
A2 - Yuliarto, Brian
PB - Trans Tech Publications Ltd
T2 - 4th International Conference on Nano and Materials Engineering, ICNME 2016
Y2 - 7 April 2016 through 8 April 2016
ER -